Our Products

Effect of RP System®

Wire bonding test at gold plating
After 500 hours in multi-layered aluminum bag 140 ºF, 95% RH. Wire-pull test using 30µm gold line.


With RP System Control
RP System Effects Image

Solderability Test with copper plate

With RP System With DesiccantNo preservative
RP System Effects Image
Solder flew evenly. Uniform adherence in cross-section.
Solder did not flow and adhere in many areas.
Bubbles are seen in cross-section.
Solder did not adhere at all.

Oxidation prevention, Discoloration prevention, Long term preservation

Iron Test Piece
Room Temp, 3 years
Sintered Parts
140ºF 95%RH, 15days
RP System Effects Image RP System Effects Image
Ceramic Condenser (Silver Plated)
H2S 15ppm 104ºF 80% RH 32days
Copper Powder for Conductive
Paste Room Temp. 2 years
RP System Effects Image RP System Effects Image